371824B00032G

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Product Overview

MPN

371824B00032G

MFG

Category

Description

HEATSINK BGA 371824B00032

BGA heatsinks are essential for thermal management of high-power ball grid array packages in servers, networking equipment, and industrial control systems where die temperatures must be maintained within operating limits. These are commonly found in baseband processors, power management ICs, and ASICs that generate significant heat during continuous operation.

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Technical Resources

RoHS Status:

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Datasheet:

Inventory & Availability

MPN

371824B00032G

In Stock Quantity
104
Price per Unit
Requires Quote
Lead Time
In Stock
Ships From
San Clemente, CA
Country of Origin
CHINA
1637
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A minimum order of $250.00 is required unless prior approval is granted.

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