TYD0GH221664RA

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Product Overview

MPN

TYD0GH221664RA

MFG

Category

Description

221FBGA EMCP 8+8 8GB RPMB

An 8 GB EMCP (embedded multi-chip package) combining NAND flash and DRAM on a single BGA substrate is designed for smartphones, tablets, and compact embedded systems where consolidated memory footprint directly enables thinner chassis and higher component density. Mobile-first applications requiring seamless application execution and fast file I/O operations integrate this package to balance performance and space efficiency.

TYD0GH221664RA Memory - NetSource Technology
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Technical Resources

RoHS Status:

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Datasheet:

Inventory & Availability

MPN

TYD0GH221664RA

In Stock Quantity
34
Price per Unit
Requires Quote
Lead Time
In Stock
Ships From
San Clemente, CA
Country of Origin
CHINA
1529
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A minimum order of $250.00 is required unless prior approval is granted.

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