50-27970-10

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Product Overview

MPN

50-27970-10

MFG

Category

Description

THERMAL PAD, 1.00 THK, WLAN HAMILTON, HAMOA IDP

This 1.00 mm thermal interface pad is specifically engineered for WLAN module thermal management in compact form-factor systems. It bridges the thermal path between RF power amplifiers and metal chassis or dedicated heatsinks to prevent thermal throttling and ensure sustained wireless performance in mobile and portable IoT devices.

50-27970-10 Hardware - NetSource Technology
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Technical Resources

RoHS Status:

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Datasheet:

Inventory & Availability

MPN

50-27970-10

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Lead Time
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