50-27970-9

Home | Parts | Hardware | 50-27970-9

Product Overview

50-27970-9

THERMAL PAD, 1.00 THK, SDX65 M.2, HAMOA IDP


A 1.00 mm thermal pad for M.2 solid-state drive form factor provides gap-filling thermal interface material between high-capacity storage controllers and heatsinks. This component is essential in enterprise and high-performance computing systems where sustained sequential read/write operations generate significant localized heat on NVMe module chipsets.

50-27970-9 Hardware - NetSource Technology

Technical Resources

A green badge indicating an electronic component is RoHS Certified
A green badge indicating an electronic component is RoHS Certified

Inventory & Availability

50-27970-9

A minimum order of $250.00 is required unless prior approval is granted.

Similar Components

Related Parts
Category Manufacturer
we’re here to support you

Not Seeing the Right Part?

Even if the part isn’t listed in stock, our global sourcing team can still quote it. Use the RFQ form below, search our Parts Catalog, or reach out directly — we’re ready to help!

Microchip on a circuit board representing global sourcing of electronic components from NetSource Technology